Surface Mount Technology (SMT)

SURFACE MOUNT TECHNOLOGY (SMT)

ATTACHING COMPONENTS TO THE PRINTED CIRCUIT BOARD‍

Global Electronics B.V. specializes in Surface Mount Technology. During the SMT process, components are attached to the printed circuit board by placing the contact pins on top of the board rather than through it, as is the case with Through Hole Technology (THT).

We have two fully automated production lines with inline AOI (automated optical inspection) for placing these components. You can therefore rely on top quality thanks to this automated inspection. One line is set up for large series and the other line for prototypes to medium volumes (batches of 1 to 10,000 pieces).

The techniques we offer with SMT:

- Reflow soldering

With this technique, each product is given its own soldering profile based on component selection and PCBA stack-up. We periodically check these profiles and adjust them where necessary to ensure that we always work within the applicable standards.

- Vapor phase soldering

The constantly stable temperature and oxygen-free environment make it possible to solder PCBA's with complex heat management using this technique.

- Wave soldering

This method is used when combining SMT on the bottom side and THT on the top side of the PCBA. The technique has now largely been replaced by the combination of reflow with selective soldering, but we still have machines and expertise in the field of wave soldering.